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Mainly used for precise temperature control of multiple reaction chambers in semiconductor processes, the device consists of a heat exchanger, a circulating pump, a compressor, and a control system. Advanced control algorithms are used to improve the stability, temperature control accuracy, and reaction speed of the chiller. The temperature control accuracy can reach ± 0.5 ℃ under load conditions, and can be controlled arbitrarily between -20 ℃ and 85 ℃, with good temperature stability.

The thermal control chuck flat panel, also known as the temperature control chuck, temperature control flat panel, rapid temperature change chuck, high and low temperature control temperature chuck, is equipped with a refrigeration system to avoid the consumption of liquid nitrogen and carbon dioxide, providing an accurate and controllable temperature platform that can quickly heat, cool or maintain temperature,

Also known as: contact type high and low temperature equipment, contact type local rapid temperature rheometer, contact type chip high and low temperature testing equipment, energy transfer is achieved by directly adhering the testing head to the tested device. Compared with traditional airflow type high and low temperature equipment (heat flow meter, temperature box, etc.), it has the characteristics of high temperature rise and fall efficiency, simple and convenient operation, compact size, and low noise.

Using a set of cooling heat exchangers and a set of heating heat exchangers, the proportion control valve is used to control the heat and cold entering the heat exchanger, and then the unified medium is input into the reactor jacket for heat exchange and temperature control. The system is equipped with an expansion tank.